Home / News / Naval Research Lab Uncovers New Finding in Thin-Film Growth Process for Powder Production

Naval Research Lab Uncovers New Finding in Thin-Film Growth Process for Powder Production

NRL image
NRL image

U.S. Naval Research Laboratory scientists have found that core particles of different sizes in a powder batch tend to develop the same level of shell thickness when subjected to a thin-film growth process called particle atomic layer deposition.

The p-ALD process is a chemical vapor deposition-based process used in the electronics sector that works to coat devices with dielectric thin film materials, NRL said Wednesday.

“Particle atomic layer deposition is highlighted as a technology that can create new and exciting designer core/shell particles to be used as building blocks for the next generation of complex multifunctional nanocomposites,” said Boris Feygelson, research engineer at NRL’s electronics science and technology division.

“Shell-thickness is most often a crucial parameter in applications where core-shell materials can be used to enhance performance of future materials.”

Researchers used a transmission electronic microscope to measure the growth of alumina shell on tungsten-based core particles.

They also found that the uniformity of shell thickness on various particle sizes can be attributed to water, which serves as a reactant in the p-ALD process.

The study was published in the Journal of Vacuum Science and Technology A.

Check Also

GAO: Air Force to Deploy New Combat Rescue Helicopters to Active Component by FY 2020

The Government Accountability Office has found that the U.S. Air Force intends to start fielding in fiscal 2020 new Combat Rescue Helicopters to replace aging HH-60G Pave Hawk helicopters that have recorded the most flight time when it comes to staff recovery missions. GAO said in a report published Thursday the service will initially deploy the new helicopters to the active component six years ahead of the reserve component and to the Air National Guard by 2027.

Leave a Reply

Your email address will not be published. Required fields are marked *