Defense Secretary Lloyd Austin Travels to Ukraine to Discuss Security Assistance
U.S. Defense Secretary Lloyd Austin has made a visit to Ukraine to emphasize U.S. support for the nation in the ongoing ...
NIST Issues Guidance on Integrating ICT Risks in ERM Programs
The National Institute of Standards and Technology has issued two new special publications designed to help decision makers incorporate information ...
CISA Publishes Supplement to HPH Cyber Risk Summary
The Cybersecurity and Infrastructure Security Agency released a supplementary document to the Healthcare and Public Health, or HPH, Cyber Risk ...
DOD Introduces New Strategy for Operations in the Information Environment
The U.S. Department of Defense has released a new strategy to improve its department-wide information capabilities. Centered around four key areas ...
DARPA Sets Proposers Day for Next-Generation Microelectronics Manufacturing Program
The Defense Advanced Research Projects Agency will host a proposers day on Nov. 28 to provide details on Phases 1 ...
DOD Issues Final Rule on Commercial Item Contracting Amendment
The U.S. Department of Defense has amended the Defense Federal Acquisition Regulation Supplement to partially implement a portion of the fiscal ...
Drenan Dudley Named Acting National Cyber Director
Drenan Dudley, deputy national cyber director for strategy and budget at the Office of the National Cyber Director, will assume ...
Biden to Nominate W. Kimryn Rathmell as National Cancer Institute Director
President Joe Biden has expressed his intent to nominate W. Kimryn Rathmell, a physician-scientist oncologist and educator, to lead the National Cancer ...
Sonny Hashmi: GSA Aims to Speed Up AI Procurement Through Repeatable Acquisition Environment
Sonny Hashmi, commissioner of the General Services Administration’s Federal Acquisition Service and a previous Wash100 Award winner, said the agency intends to ...
NIST Director Laurie Locascio Announces $3B Program to Bolster U.S. Advanced Packaging Manufacturing
The Biden administration is earmarking $3 billion for the National Advanced Packaging Manufacturing Program for semiconductors. Laurie Locascio, director of ...