The Defense Advanced Research Projects Agency has begun soliciting information on a planned design challenge to drive the development of 3D heterogeneously integrated, or 3DHI, microsystems by providing access to capabilities developed through the Next Generation Microelectronics Manufacturing, or NGMM, program.
According to a notice published Friday, DARPA’s Microsystems Technology Office will accept responses to the RFI through Aug. 29.
Through the RFI, DARPA seeks to identify innovative applications that can leverage 3DHI, determine potential barriers to fabricating 3DHI components and identify potential offerings that would help promote the use of 3DHI and foster engagement with NGMM.
What Is DARPA’s NGMM Program?
NGMM seeks to advance 3DHI microelectronics through the creation of a domestic open-access prototyping and pilot line capability that could be accessed by government, academic and private sector users.
The DARPA program’s foundational goal is to establish a self-sustaining manufacturing center for research and development and pilot production of high-performance 3DHI microelectronics.
In July 2023, DARPA selected 11 teams to establish foundational research to inform the succeeding stages of the NGMM program. In November of the same year, the agency hosted a proposers day to provide details on the program’s phases one and two.
Requested Info on DARPA Design Challenge for 3DHI Microsystems
For the Design Challenge program focused on 3DHI microsystems, DARPA is asking respondents to describe specific dual-use or commercial applications that would realize substantial performance benefits from integrating 3DHI components.
Interested stakeholders should provide a detailed discussion of how 3DHI components would be designed, manufactured, and tested. They should identify the semiconductors, interconnect materials and preferred integration strategy. Responses should also include information on technical barriers to developing the 3DHI architecture.
The agency is also asking respondents to describe additional NGMM Center offerings that are needed to build 3DHI microsystems.
