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DARPA Tests USV Autonomous Refueling Capability
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DARPA Tests USV Autonomous Refueling Capability

The Defense Advanced Research Projects Agency has conducted a test to evaluate the performance of its new unmanned surface vessel, or USV.

The agency said Thursday DARPA’s No Manning Required Ship, or NOMARS, program completed the first at-sea test of the USV Defiant. The U.S. Navy’s Unmanned Maritime Systems Program Office, or PMS-406, and USV Squadron 1 collaborated to conduct the demonstration.

USV Defiant Test Process

The Navy’s experimental USVs, Ranger and Mariner, were used for the at-sea test. The Ranger acted as the receiving station of the Defiant, while the Mariner carried a customized refueling mini-station from Serco Inc., the NOMARS prime contractor.

The test showed that all parts of the refueling operation worked as expected. The team was able to pass the lead line to the refueling side, connect the refueling probe and pump water.

The USV Defiant

The USV Defiant is an unmanned 240-metric-ton lightship being developed for extended autonomous operations at sea. It is expected to be completed and deployed for an extended sea demonstration by spring 2025.

Current fueling at sea, or FAS, methods require people to manage the lines and hose which is quite challenging. NOMARS is working on an unmanned refueling concept of operations to keep personnel safe.

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Biden-Harris Administration Announces New CHIPS Incentives Awards
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Biden-Harris Administration Announces New CHIPS Incentives Awards

Samsung Electronics, Amkor Technology and Texas Instruments have secured new funding to increase semiconductor production in the United States. The grants are part of the CHIPS Incentives Program’s funding opportunity for commercial fabrication facilities, the Department of Commerce said Dec. 20. 

The companies previously signed non-binding preliminary memoranda of terms to secure the funding. 

US Awards Funding to Samsung

According to the Commerce Department, Samsung, which was first to sign a preliminary memorandum of terms, will receive up to $4.74 billion in direct funding. The incentive supports Samsung’s pledge to invest over $37 billion in the coming years to create a comprehensive ecosystem that will include research and development facilities and logic fabricators. 

Samsung will also expand its current semiconductor facilities in Austin, Texas. 

Gina Raimondo, secretary of commerce, commented that the government’s recent investment in Samsung makes the United States the “only country on the planet that is home to all five leading-edge semiconductor manufacturers.” Intel, Taiwan Semiconductor Manufacturing Company, SK Hynix and Micron also previously committed to increasing microelectronics production in the U.S. 

“Thanks to the bipartisan CHIPS and Science Act, we are unleashing the next generation of innovation, protecting our national security, and enhancing our global economic competitiveness,” Raimondo said.

Amkor Receives CHIPS Investment

Meanwhile, Amkor Technology was awarded up to $407 million in support of the company’s approximately $2 billion investment in a new advanced packaging and test facility located in Peoria, Arizona. 

Amkor is the largest U.S.-based outsourced semiconductor assembly and test company. Its advanced packaging technology is critical to meeting the global demand for artificial intelligence chips. 

According to Raimondo, the U.S. investment in Amkor ensures access to leading-edge packaging technologies and reinforces the nation’s position as a global technology leader for years to come. She added that Amkor’s Arizona activity will support critical industries, such as AI and high-performance compute. 

TI to Build New Semiconductor Factories

Texas Instruments was granted $1.61 billion in direct funding for the construction of three new state-of-the-art facilities in Texas and Utah. The company already pledged $18 billion through the end of the decade for the upcoming manufacturing sites. 

TI specializes in the production of mature-node chips, also called foundational chips, which are used in a wide range of electronic systems, including sensors, amplifiers and integrated circuits. 

Highlighting the importance of the government’s incentive award to TI, Raimondo explained that mature-node semiconductor shortage during the pandemic led to supply chain disruptions. 

“With this major investment in TI to expand U.S. capacity of these foundational semiconductors, we are strengthening our economic security, making our country safer, and creating thousands of jobs in Texas and Utah.” commented the official.

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David McKeown Named CIO Special Assistant for Cybersecurity Innovation
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David McKeown Named CIO Special Assistant for Cybersecurity Innovation

David McKeown, a former Wash100 Award winner, has been appointed special assistant for cybersecurity innovation at the Chief Information Office of the Department of Defense, effective Dec. 16.

The DOD CIO announced on LinkedIn Saturday McKeown will be responsible for developing and overseeing the Cybersecurity Center of Excellence, with a focus on handling complex challenges of innovation. He will bring years of expertise in cybersecurity, telecommunications, application development, project management and policy development to his new role.

David McKeown Career Summary

McKeown most recently served as the deputy CIO for Cybersecurity and the chief information security officer. In this dual role, he provided oversight in the area of cybersecurity and oversaw the development and maintenance of the cybersecurity program across the DOD. Gurpreet Bhatia will succeed McKeown in both roles albeit in an acting capacity.

The executive previously worked at the Department of Justice as director of Enterprise Services where he supervised the department’s information technology strategy. He also held leadership roles with the Joint Service Provider, particularly as chief of both the Enterprise Services Center and Cyber Security Center. The IT professional also spent almost two years as director of Enterprise Information and Mission Assurance for the Army Information Technology Agency.

McKeown was also part of the Air Force for 15 years. He last served as chief of the Information Assurance Division where he managed the AF IA Program. He was also the division chief of the Current Operations and Network Operations and commanded various communication units and squadrons.

Biden Signs Bipartisan Funding Bill, Prevents Government Shutdown
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Biden Signs Bipartisan Funding Bill, Prevents Government Shutdown

President Joe Biden has signed H.R. 10545, or the “American Relief Act, 2025,” into law on Dec. 21, averting a government shutdown.

Bipartisan Funding Bill

The White House said Saturday the funding bill provides fiscal year 2025 allocations to federal agencies until Mar. 14, 2025. The appropriations will support federal government projects and activities, including $100 billion for disaster relief aid, one-year economic assistance to farmers and the repair of the Francis Scott Key Bridge. The act also extends the Agriculture Improvement Act of 2018 and other expiring authorities.

NBC News said the Senate voted 85-11 to pass the funding bill overnight on Saturday. The House passed the bill with a 366-34 vote.

Biden described the bill as a compromise after President-elect Donald Trump’s demand to include a debt limit extension was left out. 

“This agreement represents a compromise, which means neither side got everything it wanted. But it rejects the accelerated pathway to a tax cut for billionaires that Republicans sought and it ensures the government can continue to operate at full capacity,” said Biden in a statement.

White House press secretary Karine Jean-Pierre, echoed Biden’s statement, saying “While [the bill] does not include everything we sought, it includes disaster relief that the President requested for the communities recovering from the storm, eliminates the accelerated pathway to a tax cut for billionaires and would ensure that the government can continue to operate at full capacity.”

Trump and adviser Elon Musk previously opposed the bipartisan agreement, paving the way for Republicans in Congress to follow suit. The last-minute intervention killed the initial bill, causing fears of a government shutdown.

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President-Elect Trump Chooses Troy Edgar as DHS Deputy Secretary
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President-Elect Trump Chooses Troy Edgar as DHS Deputy Secretary

IBM’s Troy Edgar has been nominated as the next deputy secretary of homeland security by President-elect Donald Trump. 

If confirmed, Edgar will leverage his homeland enterprise experience to support the U.S. Department of Homeland Security’s efforts in protecting the nation and advancing immigration enforcement missions. 

Troy Edgar’s Work in Trump’s 1st Presidency 

In a post on his social media platform, Truth Social, Trump noted that Edgar worked for DHS during the 45th president’s initial term in office. 

“Troy served for me previously as the chief financial officer and associate deputy under secretary of management for homeland security, where he did an outstanding job managing their $90 billion dollar budget, resourcing critical immigration policy, and funding wall construction,” Trump said in his post. 

Edgar’s Recent Roles

Edgar previously served as executive chairman, CEO, and president of Global Conductor, a company he founded in 2002. At Global Conductor, he oversaw consulting initiatives for Fortune 500 and Global 1000 customers in customer products, technology, financial and aerospace services. 

Edgar worked on the Los Alamitos, California city council for 12 years, and he served for three terms as the mayor of the city. 

“… He helped me lead the City and County revolt against Sanctuary Cities in 2018,” Trump’s post stated. “I am very excited to have Troy on our team, as he will help us Make America Great Again!”

Edgar is currently a partner at IBM, supporting federal business operations and providing strategic leadership for the company. He is also a U.S. Navy veteran.

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Navy Unveils Advanced Manufacturing Strategy
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Navy Unveils Advanced Manufacturing Strategy

The Department of the Navy has released a new strategy outlining guiding principles and providing a comprehensive framework for developing and transitioning advanced manufacturing technologies.

The U.S. Navy said Thursday the inaugural Advanced Manufacturing Strategy focuses on three lines of effort to expand DON’s advanced manufacturing capabilities to meet the current and future needs of the Navy and the U.S. Marine Corps.

3 Lines of Effort

The strategy’s three lines of effort, or LOE, are harnessing cutting-edge commercial capabilities for strategic advancement; modernizing organic depots and strengthening intermediate capabilities; and strengthening warfighter self-sufficiency for mission access.

Each LOE has several strategic goals. To harness cutting-edge commercial capabilities, strategic goals include achieving increased advanced manufacturing commercial production through acquisition programs spanning shipbuilding, munitions, aviation and land systems and expanding the department’s engineering certification and qualifications to enable commercial advanced manufacturing.

Cross-Cutting Enablers

The department has identified five cross-cutting enablers to facilitate the delivery of advanced manufacturing technologies at scale across the three lines of effort: governance, manufacturing technology maturity, standards, digital architecture and workforce development.

To achieve manufacturing tech maturity, the document calls for DON to prioritize mission critical technologies that can benefit from advanced manufacturing; adopt an agile approach to quickly adapt to emerging technologies; and integrate advanced manufacturing technologies to facilitate rapid prototyping, on-demand production and development of complex, lightweight components.

What Is Advanced Manufacturing?

According to the document, advanced manufacturing encompasses several technologies that fabricate, rework, repair or reverse engineer components or parts through novel approaches, such as 3D printing or additive manufacturing, subtractive manufacturing, advanced machining and cold spray and directed energy deposition. These technologies have significant implications and applications for naval warfare and the defense industrial base.

“The leveraging of these cutting-edge innovations will allow the Navy and Marine Corps to maintain dominance,” said Nickolas Guertin, assistant secretary of the Navy for research, development and acquisition.

“The Department will continue to expand advanced manufacturing efforts in order to deliver lethal and affordable capabilities to the warfighter at the speed of relevance,” added Guertin, a previous Wash100 awardee.

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OMB Seeks to Shore Up Domestic Chip Supply Chains via Procurement
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OMB Seeks to Shore Up Domestic Chip Supply Chains via Procurement

The Office of Management and Budget has issued new guidance to help strengthen domestic supply chains for U.S.-produced semiconductors through federal procurement.

OMB said Thursday the memorandum outlines additional management actions to improve transparency about the federal government’s demand for products and services that use mature semiconductors and ensure that the government considers input from a recently issued request for information and other market research in developing requirements and procurement strategies that leverage U.S.-made semiconductors.

On Dec. 10, OMB released the RFI to solicit input on methods the federal government can implement to strengthen the resilience of domestic semiconductor manufacturing and determine ways to incentivize government contractors to scale up their use of semiconductors produced in the U.S.

Management Actions

According to the memo, agencies should prepare forecasts by the end of June 2025 that identify any individual acquisitions expected to have a total value of $100 million or more and are planned for award in fiscal years 2026 through 2029 that are mostly for critical infrastructure.

OMB also asks agencies to update the procurement forecasts in alignment with the memo.

By Dec. 1, 2025, agencies that have published forecasts should submit to OMB and the Department of Commerce a strategic plan that addresses specific strategies they are considering to facilitate the use of chips for products and services outlined in the forecasts through dual or multiple sourcing.

OMB is encouraging agencies to perform public outreach before submitting their strategic plans.

The General Services Administration and other agencies that manage governmentwide acquisitions should take action by the end of September 2027 to ensure that contract vehicles can support orders by agencies for services or products that require dual sourcing of leading-edge, mature semiconductors.

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Commerce Dept Awards $458M for SK Hynix’s Indiana Chip Plant
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Commerce Dept Awards $458M for SK Hynix’s Indiana Chip Plant

The Department of Commerce has awarded SK Hynix $458 million in direct funding for the company’s project to build an advanced memory packaging plant in West Lafayette, Indiana.

The funding will support the South Korean company’s $3.87 billion investment to establish a facility for artificial intelligence products, advanced packaging fabrication, and chip research and development efforts, the National Institute of Standards and Technology said Thursday.

AI Hardware Supply Chain

Secretary of Commerce Gina Raimondo noted that the federal investment will strengthen the U.S. AI hardware supply chain, generate hundreds of new jobs and ensure that Indiana will play a critical role in advancing the country’s economic and national security.

“By investing in companies like SK Hynix and communities like West Lafayette, the bipartisan CHIPS and Science Act continues to supercharge America’s global technology leadership,” she added.

Domestic HBM Manufacturing Capacity

Funded by the CHIPS and Science Act, the investment will bring high-bandwidth memory, a.k.a. HBM, manufacturing capacity to the United States, courtesy of SK Hynix, according to NIST. The project is estimated to create over a thousand new jobs in Indiana and promote partnerships. Specifically, the company will work with Purdue University to research, develop, produce and package HBMs within the United States.

Apart from the direct funding, whose disbursement will be determined by construction, technology, production and commercial milestones, the CHIPS Program Office will also provide up to $500 million in loans to SK Hynix.

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Treasury Department Issues Finance AI Risks Report
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Treasury Department Issues Finance AI Risks Report

The Department of the Treasury has published a report that identifies the risks associated with the use of artificial intelligence in the financial sector and recommendations on how to mitigate them. The Treasury said Thursday that the report is based on the response of experts and industry stakeholders to a request for information issued in June. 

“Through this AI RFI, Treasury continues to engage with stakeholders to deepen its understanding of current uses, opportunities, and associated risks of AI in the financial sector,” commented Nellie Liang, under secretary for domestic finance. 

Finance Sector Calls for Government Action Against AI Risks

According to the report, the Treasury received a total of 103 comments from financial companies, technology providers, consumer advocacy groups, consulting firms and trade associations on AI deployment within the sector. 

The respondents confirmed that AI is increasingly in use across a broad range of financial functions, but relayed that the technology is introducing new risks. As a result, major industry players are cautious about expanding the rollout of AI tools. 

Some expressed concerns over the differences in the supervision of AI development and deployment in bands and non-banks, as well as the dependence of smaller players on third-party technology providers.

Through the responses, the agency identified steps that the government can take to mitigate risks associated with AI such as establishing a clear definition of models and systems relevant to the finance sector. 

Sector representatives also want expanded consumer protections and uniform compliance with laws that apply to existing and emerging technologies. In addition, the firms asked Treasury for assistance in assessing and deploying AI models and systems. 

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FCC Suggests Space Comms Band to Ease Commercial Launch
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FCC Suggests Space Comms Band to Ease Commercial Launch

Federal Communications Commission Chairwoman Jessica Rosenworcel has recommended that the 2360–2395 megahertz band be reallocated as an additional spectrum for space launch communications. 

Issued on Thursday, the FCC head’s report and order recommendation followed the commission’s November revision of its satellite spectrum-sharing rules to encourage commercial market entry, regulatory certainty and spectrum efficacy.

Rosenworcel is requesting FCC commissioners to vote on the proposed additional spectrum before the Dec. 25 deadline set under the Launch Communications Act passed in November 2024 specifying that the 2360–2395 MHz band also be tapped to support space launches. The additional spectrum builds on the FCC’s previous spectrum allocations in the 2025-2110 MHz and 2200-2290 MHz bands for space operations.

Easing New Commercial Players’ Entry

“By identifying more bandwidth for vital links to launch vehicles, we are making it simpler for new competitors to get consistent access to the spectrum they need,” Rosenworcel said, while thanking the proponents of the Launch Communications Act.

The legislation also directs the FCC to issue by March 25, 2025 new rules for the smooth processing of applications for access to the designated bands for commercial space launches. The processes that the new regulations would seek to streamline include the authorizations on using multiple frequencies for multiple launches and electronic filing and processing of applications for space launch authorizations.

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