The National Institute of Standards and Technology has expressed its intent to create a new semiconductor manufacturing institute that will use digital twin technology for production, packaging and assembly.
In a notice of intent published Thursday on Federal Register, NIST’s CHIPS Research and Development Office said it will launch a competition for a new public-private Manufacturing USA Institute with a contract value of $200 million and performance period of five years.
The agency aims to catalyze curriculum and best practices for advanced digital twins and modeling, which can be a training ground for the semiconductor workforce. The institute will also provide access to digital models and production processes by creating a marketplace for the technology in chips manufacturing.
CHIPS R&D is scheduled to issue a notice of funding opportunity in the second quarter of this year.
