The Defense Advanced Research Projects Agency has released broad agency announcements to seek research proposals for six new programs under the Electronics Resurgence Initiative.
ERI is a program that will allocate $75 million in fiscal 2018 funds to support research efforts across the six new programs in the areas of system architectures, materials and integration and circuit design over the next four years, DARPA said Wednesday.
Each thrust area will back two separate programs.
The materials and integration thrust includes:
- Three Dimensional Monolithic System-on-a-Chip or 3DSoC program
- Foundations Required for Novel Compute or FRANC program
The architectures thrust covers:
- Software Defined Hardware or SDH program
- Domain-Specific System on a Chip or DDSoc program
The design thrust includes:
- Intelligent Design of Electronic Assets or IDEA program
- Posh Open Source Hardware or POSH program
ERI will also earmark $141 million in FY 2018 funds to the Joint University Microelectronics Program and other existing initiatives such as the Circuit Realization at Faster Timescales and Common Heterogeneous Integration and IP Reuse Strategies programs.
“These new ERI investments, in combination with the investments in our current programs and JUMP, constitute the next steps in creating a lasting foundation for innovating and delivering electronics capabilities that will contribute crucially to national security in the 2025 to 2030 time frame,” said Bill Chappell, director of DARPA’s microsystems technology office and ERI head.
DARPA will hold proposers days for the SDH and DSSoC programs on Sept. 18 and 19 in Arlington, Virginia.
Proposers days for design area’s POSH and IDEA programs will take place on Sept. 22 in Mountain View, California, while DARPA will hold a webinar on Sept. 15 on the FRANC program.
The agency will also hold a proposers day for the 3DSoC program on Sept. 22 in Virginia.